Liebert® XDU60 Coolant Distribution Unit
Designed to remove barriers to liquid cooling in an air-cooled, environment the Liebert® XDU060 Coolant Distribution Unit is a liquid-to-air heat exchanger for direct to chip cooling applications that offers easy, cost-effective deployment in any data center. The Liebert® XDU060 operates without facilities water and provides an isolated water secondary circuit, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
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- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Liebert® XDU60 Coolant Distribution Unit
Designed to remove barriers to liquid cooling in an air-cooled, environment the Liebert® XDU060 Coolant Distribution Unit is a liquid-to-air heat exchanger for direct to chip cooling applications that offers easy, cost-effective deployment in any data center. The Liebert® XDU060 operates without facilities water and provides an isolated water secondary circuit, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Specifications
Technical Specifications
Liebert® XDU60 Coolant Distribution Unit
As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ XDU simplifies your work with the flexibility to support rear door heat exchangers or direct contact liquid cooling. The Vertiv XDU’s compact footprint allows for end of row or perimeter placement. However, and wherever you incorporate the Vertiv XDU, you can easily distribute coolant to efficiently manage power-dense hot spots liquid to liquid up to 450 kW or 1,368 KW. Compact footprint for deployment flexibility within the row or perimeter; Efficient Cooling Distribution to manage power-dense hot spots and up to 450 kW or 1,368 kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.
- Product Specifications
- Net Sensible Nominal Capacity kBtuh[kW]*
- 63.0 kW
- Nominal Airflow Data Center Air (CFM, m3/H)
- 5650 m3/h (3325 CFM)
- Input Voltage (V/Phase/Frequency Hz)
- 208V, 3PH, 60Hz
- Controls and Monitoring
- Color touch screen display
- Key Components
- Redundant pump design, variable-speed pump controls, and electronically commutated (EC) fans
- Physical Characteristics
- Weight
- 847 lbs
- Weight
- 384 kgs
- Height
- 42U, 78 3/4 in
- Height
- 2000 mm
- Width
- 23 5/8 in
- Width
- 600 mm
- Depth
- 46 1/4 in
- Depth
- 1175 mm
*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.
