Vertiv™ MegaMod™ CoolChip: Next-Generation Prefabricated Infrastructure for AI & HPC
The Vertiv™ MegaMod™ CoolChip is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape, the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing delivering scalable, prefabricated, and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, MegaMod™ CoolChip is designed to support the most demanding compute environments, combining direct-to-chip liquid cooling with flexible air-cooled architectures effectively manage the intense heat loads generated by AI and HPC applications and ensure optimal performance and reliability. MegaMod™ CoolChip supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.
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Vertiv™ MegaMod™ CoolChip: Next-Generation Prefabricated Infrastructure for AI & HPC
The Vertiv™ MegaMod™ CoolChip is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape, the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing delivering scalable, prefabricated, and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, MegaMod™ CoolChip is designed to support the most demanding compute environments, combining direct-to-chip liquid cooling with flexible air-cooled architectures effectively manage the intense heat loads generated by AI and HPC applications and ensure optimal performance and reliability. MegaMod™ CoolChip supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.
Benefits
- EXPEDITED ROLLOUT: Pre-engineered, prefabricated, and fully tested design enables significantly faster time-to-market — minimizing setup time and accelerating operational readiness.
- SCALABLE SOLUTION: Flexible architecture supporting growth up to 10 MW and beyond.
- HYBRID COOLING APPROACH: MegaMod™ CoolChip is a versatile thermal solution designed to support a wide range of AI technologies powered by next-generation GPU processors. Integrates direct-to-chip liquid cooling with air cooling for maximum efficiency.
- SINGLE POINT OF CONTACT: Vertiv manages all aspects from design to deployment.
- GLOBALLY AVAILABLE SERVICES: Comes with a comprehensive industry service presence, providing your business operations 24/7 expert support and protection worldwide.
Features
- PREFABRICATED, MODULAR SOLUTION: Deployed as a standalone modular data hall, minimizing on-site labor, reducing deployment time, and ensuring consistent quality.
- PURPOSE-BUILT FOR AI AND HPC: Optimized for Pod-style AI deployments and similar high-density configurations.
- FULLY INTEGRATED DATA CENTER SOLUTION: A complete, end-to-end solution built on Vertiv’s integrated portfolio, bringing together all critical components for optimal performance.
- QUALITY ASSURED: Factory-integrated components with rigorous testing.
- VERTIV™ UNIFY ONBOARD INTELLIGENCE SOLUTION: Delivers advanced monitoring, control, and automation, simplifying data center operations into a single, unified interface.
