High density modular cooling systems deliver energy-efficient and flexible cooling solutions for data centers with more than 30kW per rack. They are available in open or closed architecture and pumped refrigerant-based or water-based technology. These solutions allow expansion without interruption of cooling operations using optional pre-charged flexible piping with threaded quick connect fitting.
Refrigerant-based units are best to use around electronic equipment as they operate at low pressure in the piping circuit and become gas at room conditions. They support a hot aisle/cold aisle approach. They come in floor-mount, rack-mount and ceiling-mount configurations so they require little or no floor space.
Water-based cooling solutions come in rack enclosures or door-mounted models. They leverage the building’s current chilled water system. They offer an alternative heat removal solution to critical applications where the hot aisle/cold aisle approach to cooling is not practical.
Some of these units have easily-installed rack fan unit to provide airflow and energy-efficient design.
High Density Modular Cooling Systems are designed for high density equipment requiring precise cooling and protection, communication enclosure, data centers and servers.
View Vertiv’s High Density Modular Cooling products at the Rack Cooling portfolio.